Shenzhen Herolaser Equipment Co., Ltd.

HEROLASER, SUIT YOU BETTER! Jack Zhang sales08@herolaser.com 0086 134 8082 6552

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Versatile 355nm PCB High Precision Laser Cutter For Depaneling

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Shenzhen Herolaser Equipment Co., Ltd.
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrJack Zhang
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Versatile 355nm PCB High Precision Laser Cutter For Depaneling

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Brand Name :Herolaser
Model Number :ML-CT-A01-500W
Certification :CE, FDA
Place of Origin :China
MOQ :1 SET
Price :Negotiable
Payment Terms :T/T, Western Union
Supply Ability :200 sets/month
Delivery Time :20 days
Packaging Details :Wooden case package: 1700 ×1250 ×1750 mm/1500 KG
Application :Laser Cutting / laser marking
Laser wevelength :355nm
Electricity demand :220V /50Hz/32A
Effective cutting range :450mm*450mm
Cutting thickness :≤0.4mm
Cutting speed :≤2m/s
Line width :0.02mm
Power consumption :≤3KW
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PCB Laser Cutter High Precision Laser Cutting Machine for FPC, PCB, FR4 and Cover Film

Introduction of machine:

It is a laser system that is used for depaneling, separating, and singulating individual circuit boards from an array of many boards on one large panel. It is an alternative method with distinct advantages over other forms of PCB depaneling such as routers, dicing saws or die punches.

PCB laser cutting uses a high-powered beam to cut material based on computer software controlled parameters.

Advantages of PCB cutter:

No stress
Mechanical methods are hard on the solder joints of a PCB.

No Burrs
A laser-cut boards edge is smooth and clean, there is no need for further downstream processing.

No particles
Lasers do not create the dust particles as generated by traditional mechanical cutting methods such as dicing saws and routers.

Therefore, any downstream cleaning can be eliminated entirely from the production line.

This is especially important for PCBs with optical components such as camera lenses, but also helps to reduce failures of on-board sensors.

Versatility
Lasers are significantly more versatile than mechanical methods on both the application and material side.

They are typically able to cut, drill, ablate metal, and skive a wide variety of PCB materials such as FR4, Rogers microwave substrates, Polyimide, fired ceramics, LTCC and so on.

Product parameters:
Item Parameters
Laser wavelength 355nm
Effective cutting range 450mm*450mm
Cutting thickness ≤0.4mm
CCD automatic positioning accuracy 7μm
Cutting speed ≤2m/s
Workable positioning accuracy ≤0.02mm
Repeat positioning accuracy ≤±0.01mm
Electricity demand AC220V±5%/50Hz
Power consumption ≤3kw
Galvanometer repeat accuracy ±3μm

Applied area and materials:
Suitable for FPC flexible circuit board, flexible circuit board sub-board processing, including contour cutting processing, grooving, opening, FR4/ battery film window, etc. widely
Samples for reference:
Versatile 355nm PCB High Precision Laser Cutter For Depaneling
FAQ
1. How is the payment?
  • 30% deposit before production and the balance 70% before shipment
2. How is the delivery and shipment?
  • Ship in 7 days after 100% payment;
  • Plywood box packaging
3. How will you guarantee aftersales services?
  • We offer two warranty for laser source, one year for whole machine and lifetime maintenance services.
  • Engineers available to service machinery overseas
  • Free technical training in our factory
  • Free sample can be sent to you
  • Professional technical team 24 hours online
4. How about your presales service?
  • Speeding offer within 8 hours quick response and free consulting.
  • Free sample cutting or testing is available
  • Progressing solution design to all clients, including distributors and end users.

Versatile 355nm PCB High Precision Laser Cutter For Depaneling

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