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PCB Laser Cutter High Precision Laser Cutting Machine for FPC, PCB, FR4 and Cover Film
It is a laser system that is used for depaneling, separating, and singulating individual circuit boards from an array of many boards on one large panel. It is an alternative method with distinct advantages over other forms of PCB depaneling such as routers, dicing saws or die punches.
PCB laser cutting uses a high-powered beam to cut material based on computer software controlled parameters.
No stress
Mechanical methods are hard on the solder joints of a PCB.
No Burrs
A laser-cut boards edge is smooth and clean, there is no need for further downstream processing.
No particles
Lasers do not create the dust particles as generated by traditional mechanical cutting methods such as dicing saws and routers.
Therefore, any downstream cleaning can be eliminated entirely from the production line.
This is especially important for PCBs with optical components such as camera lenses, but also helps to reduce failures of on-board sensors.
Versatility
Lasers are significantly more versatile than mechanical methods on both the application and material side.
They are typically able to cut, drill, ablate metal, and skive a wide variety of PCB materials such as FR4, Rogers microwave substrates, Polyimide, fired ceramics, LTCC and so on.
Item | Parameters |
Laser wavelength | 355nm |
Effective cutting range | 450mm*450mm |
Cutting thickness | ≤0.4mm |
CCD automatic positioning accuracy | 7μm |
Cutting speed | ≤2m/s |
Workable positioning accuracy | ≤0.02mm |
Repeat positioning accuracy | ≤±0.01mm |
Electricity demand | AC220V±5%/50Hz |
Power consumption | ≤3kw |
Galvanometer repeat accuracy | ±3μm |